The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 28, 1993

Filed:

Apr. 05, 1990
Applicant:
Inventors:

Osamu Kudoh, Tokyo, JP;

Kenji Okada, Tokyo, JP;

Hiroshi Shiba, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
174261 ; 361778 ;
Abstract

An interlayer connection structure for an integrated circuit includes a substrate, a first level horizontal conductor formed on the substrate, an interlayer insulator formed to cover the first level conductor, a second level horizontal conductor formed on the interlayer insulator, and a vertical conductive pillar extending through the interlayer insulator for interconnecting the first level horizontal conductor and the second level horizontal conductor. The vertical conductive pillar has a side surface coplanar with a longitudinal side surface of the first level horizontal conductor at a position where the vertical conductive pillar is in electric contact with the first level horizontal conductor.


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