The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 1993
Filed:
May. 28, 1992
Applicant:
Inventors:
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
523435 ; 528 21 ; 528 27 ;
Abstract
A composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a silicone-modified epoxy resin, (C) an imidazole curing agent having a solubility of up to 0.1% by weight in epoxy resin (A) at 25.degree. C., and (D) fused silica having a mean particle size of up to 10 .mu.m and adjusted to a viscosity of up to about 4,000 poise at 25.degree. C. satisfies the requirements for flip chip encapsulation since the composition has improved shelf stability and filling ability and cures into products having improved moisture resistance. Semiconductor devices encapsulated with cured products of the composition remain reliable because of moisture resistance.