The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 1993
Filed:
Feb. 06, 1992
Applicant:
Inventor:
Seiji Ochi, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
136256 ; 136262 ; 257457 ; 257459 ; 257773 ; 257775 ; 257923 ;
Abstract
In a semiconductor device having a metal electrode on a crystalline semiconductor surface, the metal electrode includes first portions electrically and mechanically connected to the surface and second portions mechanically separated from the surface and having configurations that easily deform. These first and second portions are alternatingly arranged on the surface. Accordingly, stress applied to the semiconductor beneath the electrode is reduced and deformation of the semiconductor element due to thermal stress is prevented, thereby preventing deterioration of element characteristics.