The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 1993
Filed:
Sep. 20, 1991
Applicant:
Inventors:
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156 64 ; 156358 ;
Abstract
A die bonding apparatus includes a Z-axis direction drive mechanism having a main drive motor, a bonding arm having a first arm and a second arm, a holding device provided on one end of the second arm for releasably holding a die, a torque generating device for applying a torque to the second arm, a parallel position detecting device for detecting a displacement of the second arm from a state in which the die and the bonding surface are parallel to each other and for generating a displacement signal, and a control device for storing an inclination of the bonding surface beforehand and for controlling the descent of the second arm and the application of a load to the die.