The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 1993

Filed:

Nov. 27, 1991
Applicant:
Inventors:

Craig S Chamberlain, Woodbury, MN (US);

Daryl D Dressler, St. Paul, MN (US);

Brian J Fish, White Bear Lake, MN (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B / ;
U.S. Cl.
CPC ...
219 1057 ; 219 / ; 219 / ; 219 / ; 219 1079 ; 174 41 ; 174 92 ; 174 93 ;
Abstract

A method and article for microwave bonding of thermoplastic closures such as that used in splicing telecommunications wires. The article is a composite bonding material (CBM) having a thermoplastic matrix (preferably polyethylene) which is miscible with the thermoplastic material of the closure, and a plurality of microwave susceptor particles dispersed throughout the matrix. A strip is fashioned from the CBM and may be applied to the sealing edges of the closure. Upon application of microwave energy in an amount sufficient to heat the susceptors and cause both the CBM matrix and the adjacent portion of the closure to melt and flow together, a fusion bond is produced which seals the closure. If the closure is being used with a cable having an inner conductive layer or sheath, a second CBM may be used at this seal, having magnetically reactive susceptors.


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