The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 1993
Filed:
Jun. 02, 1992
Applicant:
Inventors:
Ray L Hauser, Boulder, CO (US);
Bolin Zheng, Boulder, CO (US);
Assignee:
Hauser Chemical Research, Inc., Boulder, CO (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; C25D / ;
U.S. Cl.
CPC ...
505-1 ; 205 51 ; 205138 ; 205170 ; 205224 ;
Abstract
Processes and techniques are described for concurrent electroplating of yttrium, barium and copper from aqueous solution onto a desired substrate (e.g., nickel, nichrome or silver). Compounds of these elements are dissolved in solution and then placed in a plating cell in which the cathode is the substrate on which the elements are to be deposited. After the elements have been deposited, they are oxidized to provide the desired perovskite structure. The process may be continuous or non-continuous.