The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 14, 1993

Filed:

May. 26, 1992
Applicant:
Inventors:

Noboru Hayama, Tokyo, JP;

Yoshiharu Ohinata, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41L / ;
U.S. Cl.
CPC ...
101120 ; 101124 ; 101116 ;
Abstract

In a stencil printing including the steps of supplying ink in the form of a layer on one side of a perforated stencil sheet, contacting another side of the stencil sheet to a surface for printing, applying a pressure to the ink layer by a pressing means so as to transfer the ink of the ink layer through perforations of the stencil sheet from the one side to the other side of the stencil sheet and to attach the ink thus transferred onto the surface for printing, and detaching the surface for printing from the other side of the stencil sheet, the improvement is which the surface for printing is detached from the other side of the stencil sheet at a portion thereof where a movement of the ink layer relative to the stencil sheet is substantially impeded by the pressing means so that a drawing out of the ink from the ink layer onto the surface for printing due to the adhesiveness and viscosity of the ink does not occur when the surface for printing is detached from the stencil sheet, thus also allowing the extrusion of the ink through the stencil perforations to be expedited before the stencil sheet tightly contacts the printing surface, so as to avoid blank shadows of fibers of the stencil sheet, while avoiding the problem of back contamination.


Find Patent Forward Citations

Loading…