The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 1993
Filed:
Nov. 19, 1991
Hideki Zenitani, Kawasaki, JP;
Mitsuo Okawachi, Kawasaki, JP;
Hisato Sato, Kawasaki, JP;
Haruhiko Horizoe, Kawasaki, JP;
Naoya Yamazaki, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A cooling structure for LSI or the like devices to be mounted in a small size electronic apparatus housing. A main printed circuit board has mounted thereon first electronic devices with low heat generation; at least one auxiliary printed circuit board has mounted thereon a second electronic device with high heat generation, which is connected with one edge of the main printed circuit board (1) through a flexible printed circuit tape (5); a holder (6) fixed on the main printed circuit board (1) for resiliently supporting the auxiliary printed circuit board (2) at a distance above the former when the latter is turned over and is above the main printed circuit board (1) by bending the flexible printed circuit tape (5) so that a heat conductive surface of the second electronic device (4) is exposed outside. This printed circuit board assembly (A) is accommodated in a housing (B) made of a heat conductive material so that the heat conductive surface of the second electronic device (4) is brought into close and resilient contact with the inner wall (14) of the hosing (B).