The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 1993
Filed:
Feb. 28, 1992
Naoto Ueda, Itami, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
In a manufacturing method for a semiconductor device, first, a diffused layer of a soldering material is provided previously either on the reverse surface of a die or on the obverse surface of a die pad. Then, a diffusing layer is formed on either surface of the diffused layer. The diffusing layer between the die and the die pad is brought into contact with the die and die pad, and then these components are heated. The die is thereby and fully bonded to the die pad, even when the diffusing layer, which is an initial bonding layer, is made thinner. Because the time for the diffusing layer to diffuse can be shortened, the time for installing the die can also be shortened.