The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 07, 1993
Filed:
Jul. 30, 1992
Masashi Tsunabuchi, Tokyo, JP;
Taihei Takeshita, Tokyo, JP;
Tadanori Ishikura, Tokyo, JP;
Akifumi Takashima, Tokyo, JP;
NEC Corporation, Tokyo, JP;
EIGHTECH TECTRON Co., Ltd., Tokyo, JP;
Abstract
An automatic reflow soldering apparatus for soldering a printed circuit board having a plurality of electronic elements mounted thereon to be soldered while the printed circuit is heated, wherein transporting means transports a carrier carrying the printed circuit board to be soldered, positioning means arranged on the carrier position the printed circuit board on the carrier and support means arranged on the carrier support the printed circuit board to prevent the latter from being warped when heated to be soldered. The printed circuit board is transported through all of the soldering processes from a heating process to a cooling process while the printed circuit board is thus positioned and supported. Further provided is means which is automatically operated to position and support the printed circuit board on the carrier.