The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 1993
Filed:
Jul. 06, 1992
Applicant:
Inventors:
Harry J Geyer, Phoenix, AZ (US);
Ronald M Lahti, Chandler, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; H01L / ;
U.S. Cl.
CPC ...
228102 ; 22818021 ; 228-62 ; 228-9 ; 228 447 ;
Abstract
A method of producing reliable bonds of a lead to a bump on a semiconductor chip is accomplished by controlling the amount of deformation of the lead and the bump during bonding. A differential amplifier is used to sense the deformation and stop the application of force to the lead and the bump when a desired amount of deformation of the lead and the bump is obtained.