The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 1993
Filed:
Jun. 19, 1991
Applicant:
Inventors:
Akinori Hanawa, Shimotsuma, JP;
Mitsuo Yokota, Yuki, JP;
Akira Shimizu, Shimodate, JP;
Kazuyuki Tanaka, Hitachi, JP;
Yukihiko Yamashita, Hitachi, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ;
U.S. Cl.
CPC ...
428249 ; 428251 ; 428253 ; 428264 ; 428268 ; 428273 ; 428274 ; 525 65 ; 525438 ;
Abstract
A thermosetting resin composition comprising (A) a dibasic acid modified epoxy (meth)acrylate resin obtained by reacting a bromine-containing epoxy resin with a dibasic acid of 4 or more carbon atoms followed by further reacting with acrylic acid or methacrylic acid, (B) a thermosetting resin having an unsaturated group, the unsaturated group being copolymerizable with the resin (A), and (C) a polymerizable monomer; and an electrical laminate produced by using the thermosetting resin composition are disclosed.