The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 24, 1993
Filed:
Jan. 24, 1992
Nozumu Hama, Sayama, JP;
Takaaki Sato, Sayama, JP;
Akihiko Koshiro, Sayama, JP;
Masao Tegawa, Sayama, JP;
Tomio Iino, Sayama, JP;
Seiji Yanagisawa, Sayama, JP;
Nobuo Kikuchi, Sayama, JP;
Kazuo Migishima, Sayama, JP;
Kazumi Ishida, Sayama, JP;
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
An apparatus for molding a product of synthetic resin which includes a mold assembly having a die plate and first and second mold dies which define a mold cavity therebetween. The first mold die includes a fixed member fixed to the die plate. At least two movable members are respectively displaceable in perpendicular directions away from each other. Each of the movable members are mounted on the die plate and are further displaced from the fixed member to open the first mold die. A resilient member is provided for perpendicular contacting the movable members and urging the movable members toward the fixed member to assembly the first mold die together.