The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 17, 1993
Filed:
Sep. 21, 1992
Kiyohide Tsuchiya, Kitakyushu, JP;
Michihiro Shimamura, Kitakyushu, JP;
Katsuaki Nakagawa, Kitakyushu, JP;
Shuji Masuda, Kitakyushu, JP;
Kazuhiro Marumo, Kitakyushu, JP;
Tadashi Ogata, Kitakyushu, JP;
Nippon Steel Corporation, Tokyo, JP;
Nittetsu Plant Designing Corp., Fukuoka, JP;
Abstract
The present invention relates to a vertical type stream plating apparatus for plating the surface of a metal strip with tin, chromium, copper or the like. Fundamentally, the apparatus comprises an electrolyte feeding nozzle for feeding an electrolyte into a space between electrodes, a side seal provided on both sides in the widthwise direction of the electrode and a pressure equalizing chamber provided on the backside of the electrode. The apparatus further comprises a electrode having a plurality of through holes communicating with the pressure equalizing chamber provided in an electrode box, waste electrolyte equipment provided with a waste electrolyte box for gathering and discharging the electrolyte and a seal equipment provided at the lowermost portion of the apparatus for preventing the outflow of the electrolyte. The above constitution enables the flow rate distribution of the electrolyte in the widthwise direction of the strip to be made more homogeneous than the prior art and enables the flow rate of the electrolyte to be increased without causing problems of vibration (fluttering phenomenon) of the strip and adsorption of the strip to the electrode, which contributes to an increase in the speed of plating and an improvement in the quality of plating.