The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 1993
Filed:
Feb. 11, 1992
Makoto Kobayashi, Kawanishi, JP;
Syoichi Mizuuchi, Nishinomiya, JP;
Reiko Watanabe, Toyonaka, JP;
Toshio Matsumoto, Yao, JP;
Naoki Muraoka, Nishinomiya, JP;
Tosiyuki Masuda, Kashihara, JP;
Matsushita Electric Industrial Co. Ltd., Osaka, JP;
Ishikawa Metal Co., Ltd., Osaka, JP;
Abstract
A soldering paste for light beam-heating soldering containing a flux which contains 2 to 8 % by weight of a thixotropic agent having a melting point of 140.degree. to 150.degree. C., 1.8 to 3.0 % by weight of an activator containing cyclohexylamine hydrobromide, 40 to 50 % by weight of a rosin component and 40 to 50 % by weight of a solvent; and spherical solder particles having a particle size of 250 to 400 mesh and an oxygen content of not larger than 200 ppm, in which a content of the flux in the soldering paste is from 9 to 13 % by weight and the soldering paste has a thixotropy index of 7 to 8.