The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 1993
Filed:
Aug. 17, 1992
Applicant:
Inventor:
Katsuro Hiraiwa, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65B / ;
U.S. Cl.
CPC ...
156 69 ; 156292 ; 156315 ; 156322 ; 156329 ; 156330 ; 174 524 ; 257702 ; 257704 ; 257710 ;
Abstract
A process for hermetically sealing a cap (7) to a package base (1), on which a semiconductor chip (2) is mounted, by an adhesive resin. First, the base (1) is coated with a thermosetting silicone resin (10) along a frame-shaped abutting portion, then the silicone resin is completely hardened and becomes a silicone rubber, and thereafter, the silicone rubber is coated with a thermosetting sealing resin (11) having a good adhesion with the slicone rubber. The cap is then abutted against the base, and the base and cap are heated while a pressure is exerted thereon to press the base and the cap toward each other.