The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 1993
Filed:
Aug. 12, 1991
Eiji Kozuka, Yokohama, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
In a semiconductor device including a semiconductor chip, a lead frame with a die pad and plural leads, and a sealing body. The die pad is divided into a plurality of small pieces, and at least one of the plural divided pieces is electrically connected to at least one lead to which a potential is applied. Since the divided die pad is used as a wiring lead, the inductance and resistance of the voltage supply line or the ground line within the chip can be reduced, thus reducing the occurrence of supply voltage and output noise for prevention of erroneous operation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile