The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 1993
Filed:
Mar. 17, 1992
Applicant:
Inventor:
Kiyoaki Tsumura, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257782 ; 257783 ; 257784 ; 257771 ;
Abstract
A semiconductor device formed by a semiconductor chip bonded to a lead frame die pad. The bonding material, such as a silicone resin, has an elasticity modulus ranging from 1 Kg/cm.sup.2 to 100 Kg/cm.sup.2 from room temperature to 400.degree. C. The lead frame electrodes are connected to the semiconductor chip electrodes by copper alloy wires.