The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 1993
Filed:
Aug. 13, 1991
Carlos Caggiani, Boca Raton, FL (US);
Sermatech International, Inc., Limerick, PA (US);
Abstract
A method and apparatus for separating an upper (12) and lower (14) mold plate of a mold assembly (10) from a preformed substrate or casting (16) comprises a mold ejection apparatus (70) having a support surface (76) to receive and support the mold assembly (10). A plurality of clamps (84) pivotally connected to the support surface (76) engage the preformed substrate (16) at spaced apart intervals about the periphery of the preformed substrate (16) to restrain the substrate (16) and lower mold plate (14) against the support surface (76). The apparatus further includes a plurality of secondary hydraulic pumps (98) comprising a piston (106) and cylinder (108) assembly and a lifting bar (120) pivotally connected to one end of the piston (106). The secondary pumps (98) are supported on the support surface (76) at spaced apart intervals adjacent the periphery of the mold assembly (10). The lifting bars (120) engage a plurality of lifting pins (46) on the upper mold plate (12) to lift the upper plate (12) upwardly away from the substrate (16) as the substrate (16) and lower plate (14) are restrained by clamps (84) against the support surface (76). A master hydraulic pump (132) is activated to provide a simultaneous operating force to each of the secondary hydraulic pumps (98) to uniformly separate the upper mold plate (12) from the preformed substrate (16).