The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 1993
Filed:
Jul. 17, 1990
Applicant:
Inventors:
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C / ; H01L / ; H01L / ; H05K / ;
U.S. Cl.
CPC ...
365 63 ; 257666 ; 257670 ; 257676 ; 361421 ;
Abstract
The semiconductor memory module comprises a housing of plastic or ceramic in which two chips are stacked together back-to-back. The pads of the chips are electrically connected by wire bonding to beam leads which comprise outer bond leads, generally arranged outside the housing to form the contact pins or contact leads of the module to a printed circuit board, and inner bond leads in the housing. The inner bond leads are split and spread in the area of the inner lead bond ends into upper and lower sets forming a gap for receiving and holding the stacked chips.