The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 1993

Filed:

Jan. 21, 1992
Applicant:
Inventors:

Yasuaki Ogawa, Furukawa, JP;

Yasushi Takeda, Miyagi, JP;

Akira Sakai, Miyagi, JP;

Takejirou Takeda, Miyagi, JP;

Akihiro Nakamura, Miyagi, JP;

Hiroyuki Miyaguchi, Furukawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428195 ; 428 40 ; 428412 ; 428522 ; 428332 ; 428339 ; 264266 ; 264132 ; 264247 ; 264258 ; 156240 ; 156232 ;
Abstract

An in-mold decorated illumination panel including an indicator sheet, an ink printed layer formed on a back surface of the indicator sheet, the ink printed layer having a printed indicator portion, and a molded layer formed on a back surface of the ink printed layer by injection molding, wherein the printed indicator portion is illuminated from the back surface of the ink printed layer to effect indication of the printed indicator portion on a front surface of the indicator sheet. An ink dissolution preventing sheet is interposed between the ink printed layer and the molded layer for preventing ink of the printed indicator portion from being dissolved away by pressure of a molding material in the injection molding. A shrinkage adjusting material for adjusting molding shrinkage of the panel is mixed in the molded layer with a predetermined content such that a shrinkage rate of the molded layer becomes substantially equal to a shrinkage rate of the indicator sheet after the injection molding, whereby warping of the panel after the injection molding is prevented.


Find Patent Forward Citations

Loading…