The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 1993
Filed:
Jun. 13, 1991
Masahiko Nishiuma, Fussa, JP;
Chiyoshi Kamada, Kokubunji, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi VLSI Engineering Corporation, Kodaira, JP;
Abstract
A packaged semiconductor device has a package, a semiconductor IC chip disposed in a space formed in the package, a strip conductor buried at a first level in the package for carrying a signal to be coupled to the IC chip, a first reference potential conductor buried at a second level in the package for providing a reference potential for the IC chip and a second reference potential conductor buried at the first level in the package for shielding the strip conductor. A connection conductor such as a bonding wire is provided across the second reference potential conductor for connecting the IC chip with one of the ends of the strip conductor. A dielectric material is provided between the connection conductor and the second reference potential conductor to provide the connection conductor with a characteristic impedance matched with an impedance of a source of the signal the connection conductor carries. The package may have an interconnecting conductor extending to electrically connect the first and second reference potential conductors.