The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1993
Filed:
Feb. 28, 1990
Shigenori Ota, Aira, JP;
Tsuyoshi Yasutomi, Kokubu, JP;
Kenji Nakai, Aira, JP;
Masayuki Nomoto, Aira, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
The invention provide a thermal head wherein a head substrate composed by disposing plural heating resistance elements on a support board, and a flexible wiring substrate for connecting the heating resistance elements and an external circuit are adhered together by using a soft adhesive with the shear adhesion strength of 25 kg/cm.sup.2 or less. According to the invention, without having to dispose a reinforcing plate for reinforcing the flexible wiring substrate, the flexible wiring substrate and the head substrate are adhered directly with soft adhesive, and therefore when printing, especially when printing continuously, if the temperature of the head substrate and flexible wiring substrate is raised, the difference in the thermal expansion of the two is absorbed sufficiently by the elasticity of the elastic wiring substrate, and the difference in the thermal expansion between the head substrate and flexible wiring substrate and support board is absorbed by the soft adhesive, and hence the deformation of the thermal head may be eliminated completely, and the transmission of electric signal from external circuit to the integrated circuit is made accurate, so that printing may be done in normal state.