The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1993
Filed:
Jun. 17, 1991
Guido Tschulena, Wehrheim, DE;
Battelle-Institut e.V., Frankfurt am Main, DE;
Abstract
Heat dissipating devices for electronic component semiconductor chips are provided in the form of channels or grooves which are either integrated in the underside of the semiconductor chip or are formed in an additional thin semiconductor chip which has larger dimensions than the component chip and which is disposed between the underside of the component chip and the mounting base for the component chip. The channels are filled with a meltable material which is subjected to a heat absorbing phase conversion at temperatures which are critical for semiconductor component operation. In this way, short-term heat peaks in particular, can be reliably dissipated. Preferably, the channels are formed by micromechanical etching techniques and are preferably filled to the desired degree by a spin coating process.