The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1993
Filed:
Mar. 10, 1992
Hironobu Abe, Mobara, JP;
Masahiko Kadowaki, Mobara, JP;
Toshio Nakano, Chiba, JP;
Hideaki Abe, Mobara, JP;
Akiya Izumi, Mobara, JP;
Tunehisa Horiuchi, Mobara, JP;
Yoshinori Niwata, Mobara, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Device Engineering Co., Ltd., Chiba, JP;
Abstract
A packaging structure is provided which is especially useful for solid-state imaging devices and other semiconductor devices. An Al film is selectively formed on inner lead portions and portions of positioning reference plates located within a ceramic packaging body. On the other hand, the outer lead portions that are exposed outside the packaging body are coated with Sn plating layer. Particular care is taken not to locate the Sn plating layer over the Al film. Contamination faults due to Sn swelling and stripping are prevented, while bonding strength of the Al clad inner lead portions with Al internal fine wires and with fit glass joining the ceramic packaging body together is kept high.