The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1993
Filed:
Apr. 29, 1991
Toshimitsu Ishikawa, Kawaguchi, JP;
Kazuichi Komenaka, Kawasaki, JP;
Kawasaki Kaisha Toshiba, Kawasaki, JP;
Abstract
A plastic mold semiconductor device comprises a semiconductor chip; a die pad which is made of a thin metallic plate for supporting the semiconductor chip; leads which surround the die pad, wires for connecting electrodes on top of the semiconductor chip and the leads; and plastic mold for sealing the entire device; the die pad being comprised of support sections separated by a fixed gap from a sub-element interconnecting member which is insulated from the semiconductor chip, and connection between the power source or signal related lead and the electrode which is on top the semiconductor chip and is located from the power source or signal related lead is connected by the sub-element interconnecting member.