The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1993
Filed:
Jun. 03, 1991
John K Frei, Mesa, AZ (US);
Russell T Fiorenzo, Scottsdale, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A plasma based soldering method which uses a hydrogen-nitrogen gas mixture (5-15% hydrogen) to form a plasma, excited to simultaneously clean and heat solder. Only a relatively low vacuum of about 125 pascal (1 torr) is required. No heat sources beside the plasma are used to reflow the solder and no flux is necessary. Sensitive components can be shielded from plasma ion bombardment and need not be able to withstand the melt temperature of the solder used. The method is suitable for lead-tin solder and can be used to solder polyetherimide baseplates to teflon-glass printed wiring boards at junctions of gold-plated posts and matching gold-plated hole linings.