The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1993
Filed:
Sep. 08, 1992
Takeyoshi Yamada, Iwakuni, JP;
Hiroyuki Umetani, Iwakuni, JP;
Teijin Limited, Osaka, JP;
Abstract
A plural liquid pack type resin composition useful for producing a shaped resin article having an enhanced heat resistance, mechanical strength and machinability, comprises a first resinous individual component (A) comprising a polyisocyanate compound and a second resinous individual component (B) comprising a mixture of a polyol compound with a polyepoxy compound and a curing agent, or an individual sub-component (i) comprising a mixture of a polyol compound and a polyepoxy compounds and another individual sub-component (ii) comprising a mixture of the polyol compound with a curing agent, in which composition the polyol compound is contained in an amount of 10 to 40 equivalents of the hydroxyl group, the polyepoxy compound is contained in an amount of 5 to 20 equivalents of the epoxy group, and the total equivalent amount of the hydroxyl group and the epoxy groups is 15 to 45 equivalents per 100 equivalents of the isocyanate groups of the polyisocyanate compounds.