The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1993
Filed:
May. 23, 1991
Applicant:
Inventors:
Yuuji Takayama, Kanagawa, JP;
Hirokazu Matsueda, Aichi, JP;
Maseto Sugiura, Aichi, JP;
Tatsuhiko Ozaki, Aichi, JP;
Hirotaka Wada, Aichi, JP;
Iwao Komiya, Aichi, JP;
Assignee:
Takemoto Yushi Kabushiki Kaisha, Aichi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J / ; C08K / ; C08L / ; C08F / ;
U.S. Cl.
CPC ...
524437 ; 524507 ; 524521 ; 524535 ; 524534 ; 525278 ; 525455 ; 525920 ; 526301 ; 528 60 ;
Abstract
Molded products with improved dimensional stability and surface property can be obtained by in-mold curing of a polymerizable composition containing unsaturated urethane of a specified structure, alkyl (meth)acrylate, and a thermoplastic macromolecular compound capable of dissolving in or swelling by impregnating alkyl (meth)acrylate. These components are contained at specified weight ratio. The mold is initially at temperature 30.degree..about.120.degree. C. and the curing is effected in the presence of a radical initiator.