The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 1993

Filed:

Oct. 13, 1992
Applicant:
Inventors:

Chiaki Sagawa, Tokyo, JP;

Manabu Katagiri, Yokohama, JP;

Toru Kurashina, Petaling Jaya Selangor Darul Ehsan, JP;

Assignee:

NOF Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L / ; C08L / ;
U.S. Cl.
CPC ...
524275 ; 524277 ; 524487 ; 524488 ; 524489 ; 524763 ; 524904 ;
Abstract

A thermosetting powder coating composition comprises (a) a fluororesin having reactive group for crosslinking in the molecule which contains 10 weight % or more of fluorine and has glass transition temperature in the range from 35.degree. to 120.degree. C., (b) a hardener which can form crosslinking by reaction with the reactive group for crosslinking in the fluororesin (a) and (c) a synthetic wax or a natural wax. The amount of the fluororesin is in the range from 60 to 97 weight % and the amount of the hardener is in the range from 3 to 40 weight % based on the total of the fluororesin and the hardener. The amount of the synthetic wax or the natural wax is in the range from 0.01 to 10 weight parts based on 100 weight parts of the total of the fluororesin and the hardener. The coating layer formed from the thermosetting fluororesin powder coating composition has the same degree of water repellency and slipping property to those of the coating layer formed from polytetrafluoro-ethylene powder while the excellent weatherability, acid resistance and adhesion to substrates are retained.


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