The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1993
Filed:
Apr. 15, 1992
Narimichi Takei, Tokyo, JP;
Kaoru Kurita, Tokyo, JP;
Freund Industrial Co., Ltd., Tokyo, JP;
Abstract
A method of manufacturing seamless capsules, wherein multi-layer liquid flow is blown out of a multiple nozzle to form multi-layer droplets which are brought into contact with hardening liquid to be solidified to thereby manufacture the seamless capsules SC and an apparatus therefor. A groove having U-shaped section for supplying the hardening liquid and the multi-layer droplets is orientated in a direction tangent to a circular section of a hardening vessel in the hardening vessel and a helical flow is formed in the hardening liquid in the hardening vessel, whereby the multi-layer droplets are fallen, moving helically in the hardening vessel.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile