The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 29, 1993

Filed:

Apr. 03, 1991
Applicant:
Inventors:

Richard F Frankeny, Austin, TX (US);

Karl Hermann, Austin, TX (US);

Ronald E Hunt, Georgetown, TX (US);

Verlon E Whitehead, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ;
U.S. Cl.
CPC ...
439197 ; 439493 ;
Abstract

A fluid actuated connector is provided with opposing circuit members that form the interior of the connector and which are substantially L-shaped with a substantially vertical portion facing a circuit card to be inserted into the connector and a substantially horizontal portion disposed onto a printed circuit board (PCB), such as a motherboard, or the like. The circuit members are disposed adjacent a frame and connector body such that a cavity is formed adjacent the circuit members and on a side opposite the electrical connection points being being contacted with the printed circuit card. The circuit membranes are formed of a single layer of dielectric material, to maintain the required resiliency, and have contacts, which may be in the form of 'bumps' etched into an electrically conductive material applied to the surface of the dielectric facing the circuit card. The side of the circuit membrane in communication with the cavity, which is filled with a non-compressible fluid, receives the force that deforms the circuit membrane. In order to increase the force actually transferred to the contact bumps, rigid pads are placed on the inside of the circuit membrane such that the pressurized fluid acts directly on the rigid pads. These pads are etched into a metal layer deposited on the dielectric and placed substantially opposite the electrical contact bumps, thereby allowing transfer of the force from the fluid directly to the bumps without the intermediate layers of an expandable tube, bladder, or the like.


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