The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1993
Filed:
Aug. 25, 1992
Tadashi Takano, Tokyo, JP;
Kaijo Corporation, Tokyo, JP;
Abstract
A bonder that allows replacement of the bonding tool, corresponding to changes in the type of bonded component, to be performed both easily and rapidly, while also preventing the occurrence of operator-initiated errors accompanying the changes in bonded component type. As a result of allowing a bonding plate, which jointly applies compressive force to bonded components with a bonding tool, to float freely while being held by a diaphragm, the bonded components are adhered to the pressing surface of the bonding tool by the unrestricted bending of the diaphragm so as to follow its motion, thus eliminating the need for an operator to adjust the inclination of the bonding tool, as is necessary in conventional bonders.