Method for specifying and verifying positive graphics pattern positions

Abstract

A method of specifying and verifying tight toleranced positional accuracies of external conductive patterns on electronic substrates relative to non-plated tooling hole patterns in the same substrate comprising the addition of round plated or otherwise deposited disks incorporated into the conventional plated art work of the substrate. These disks are positioned at the exact ideal location of each tooling hole. When the substrate manufacturing process is complete and the tooling holes have been drilled through at a correct location, the tooling hole will be positioned within the area of each disk on the substrate. If the tooling hole or holes is/are drilled at an unacceptable location, i.e. outside of the area of the disk, then the component receiving non-plated tooling holes, plated through holes and plated lands will also be miss-positioned and the substrate is discarded. When the tooling holes are properly aligned it is now assured that the non-plated tooling holes and solder lands of each of two or more stacked substrates are properly aligned to accept various components which may extend from one stacked substrate to another.