The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 1993
Filed:
Feb. 01, 1991
Applicant:
Inventors:
Chul R Choe, Seoul, KR;
Jyong S Jang, Seoul, KR;
Assignee:
Korea Institute of Science and Technology, Seoul, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
156668 ; 156643 ; 427307 ; 427322 ; 4273899 ; 4273935 ; 427387 ;
Abstract
A method for promoting adhesion of an ultra high modulus polyethylene fiber/epoxy resin composite is proved. The method entails subjecting a fabric made from ultra high modulus polyethylene fibers to a plasma etching, applying a silane coupling agent in hydrolyzed form to the etched fabric, and impregnating the fabric with epoxy resins, followed by molding.
Choe, Chul. (1993). Method for adhesion promotion of an ultra high modulus polyethylene (U.S. Patent No. 5221432). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5221432
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile