The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 1993
Filed:
Nov. 04, 1991
Kraig A Quinn, Webster, NY (US);
Brian T Ormond, Webster, NY (US);
Josef E Jedlicka, Rochester, NY (US);
Xerox Corporation, Stamford, CT (US);
Abstract
An improved process for forming individual dies having faces that allow the dies to be assembled against other like dies to form one and/or two dimensional scanning arrays with minimal chipping and fracturing wherein the active side of a wafer is etched to form separation grooves with the wall of the grooves adjoining the die presenting a relatively wide surface to facilitate sawing, wide grooves are cut in the inactive side of the wafer opposite each separation grooves, and the wafer cut by sawing along the separation grooves, the saw being located so that the side of the saw blade facing the die is aligned with the midpoint of the wide wall so that on sawing the bottom half of the wall and the remainder of the grooves are obliterated leaving the top half of the wall to prevent cracking and chipping during sawing.