The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 1993
Filed:
Apr. 28, 1992
Applicant:
Inventors:
Assignee:
Fujitsu Limited, Kanagawa, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437211 ; 437209 ; 437215 ; 437217 ;
Abstract
A dual in-line packaging comprises a substrate having a top surface, a bottom surface and a peripheral surface, semiconductor chips mounted on the top and bottom surfaces of the substrate, a plurality of terminals fixed to the substrate and projecting from the bottom surface of the substrate, a first layer made of a first material and covering the bottom surface of the substrate and the semiconductor chips, and a second layer made of a second material and covering the top surface of the substrate and the semiconductor chips. The first material is resilient and moisture resistant and the second material is hard compared to the first material.