The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 1993
Filed:
Jul. 06, 1990
Toru Yoshida, Yomato, JP;
Suguru Sakaguchi, Chigasaki, JP;
Aizo Kaneda, Shimodate, JP;
Kooji Serizawa, Fujisawa, JP;
Munehisa Kishimoto, Kamakura, JP;
Masaaki Mutoh, Yokohama, JP;
Kunio Matsumoto, Yokohama, JP;
Isao Ohomori, Tokyo, JP;
Shingo Yorisaki, Tachikawa, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention provides a method for manufacturing a highly reliable semiconductor device without waste by incorporating predetermined functions into a wafer in a wafer completion process, aging the wafer in a wafer aging process, distinguishing between non-defective and defective chips in a probe inspection process, separating chips in the wafer one by one in a dicing process, sorting out the chips into non-defective and defective chips in a selection process, then analyzing failure information and feeding back the result of the analysis to the wafer completion process in a feedback process, thereby quickly analyzing and repairing a failure process on reliability in the wafer completion process.