The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 1993
Filed:
Aug. 15, 1991
Applicant:
Inventors:
Kazumasa Aoki, Tenri, JP;
Kazuya Fujita, Nabari, JP;
Hirofumi Uchida, Yamato-Koriyama, JP;
Takaaki Tsuda, Tenri, JP;
Takamichi Maeda, Yamato-Koriyama, JP;
Assignee:
Sharp kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427133 ; 427135 ; 427256 ; 427287 ; 427421 ; 26427217 ; 264338 ;
Abstract
A method of spraying release agent on a semiconductor chip molding die. The die has a pot for supplying resin to be molded, cavities in which semiconductor chips to be packaged are disposed, respectively, and a runner disposed between the pot and the cavities, for conducting the resin from the pot to the cavities. This method includes the steps of spraying at least the pot and the runner mentioned above with non-silicone release agent and selectively spraying only the cavities with silicone-based release agent.