The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 1993
Filed:
Oct. 01, 1990
Douglas Heckaman, Indialantic, FL (US);
Ronald Vought, Melbourne, FL (US);
Harris Corporation, Melbourne, FL (US);
Abstract
Directed millimeter wave radiation from internal elements of a microwave circuit through the housing cover, housing base, and side walls of a hermetically-sealed MMIC integrated subsystem assembly uses a waffle-wall array of conductive posts as a band rejection filter to provide walls which guide the radiated waves through a hermetically sealed window in the housing base for waveguide propagation or to a dielectric side wall or cover to radiate energy therethrough. For a waveguide launch, the launch probe is printed on a TEM mode microstrip transmission line substrate and is located over or on a dielectric window formed at the end of an air filled waveguide. A waveguide-like mode of propagation is launched perpendicular to the microstrip substrate and the energy is transmitted through the dielectric window into the air dielectric waveguide which extends through the housing base. Side wall mounted antennas use radiating elements placed near the side walls of the subsystem assembly and are surrounded on their remaining sides by the conductive post structure. The launched waves propagate toward the dielectric side wall to radiate outwardly from the subsystem assembly. For radiating energy through the subsystem assembly cover, a launch probe is located under a dielectric aperture in the hermetically-sealed cover.