The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 1993

Filed:

Jul. 11, 1991
Applicant:
Inventor:

Nozomu Takahashi, Kawasaki, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257787 ; 257666 ; 257 81 ; 257 82 ; 313499 ;
Abstract

The semiconductor of the present invention includes the first lead electrode having a tip portion on which a plurality of semiconductor elements are arranged, a plurality of the second lead electrodes each having a tip portion located close to the tip portion of the first lead electrode, bonding wires for electrically connecting the semiconductor elements and the tip portions of the second lead electrodes with each other, and a mold resin for covering at least the tip ends of the first and second lead electrodes. Further, the invention is characterized in that the second lead electrodes are not arranged in a straight line in the plane common to the end surfaces thereof, and that the second lead electrodes are arranged in a straight line in a plane which is parallel to any of the end surfaces thereof.


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