The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 1993

Filed:

Aug. 24, 1990
Applicant:
Inventor:

Yoshimasa Kudo, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257735 ; 257727 ; 257723 ;
Abstract

A semiconductor device comprises a semiconductor element having a PN junction, a first connector having a first connection surface rising in an embossing manner, connected to a first surface of the semiconductor element via a solder layer at the first connection surface, a second connector having a second connection surface rising in an embossing manner, connected to a second surface of the semiconductor element via a solder layer at the second connection surface.


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