The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 1993
Filed:
Aug. 28, 1991
Masaya Tamamura, Inagi, JP;
Yoshiro Morino, Tsukuba, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
An IC package comprising a dielectric package body for encapsulating the semiconductor chip (31) and including a bottom member (1), first and second dielectric annular members (3, 7) surrounding the semiconductor chip, and a cap member (10). A first portion of the upper surface of the first dielectric annular member (3) is covered by the second dielectric annular member and a second portion of the upper surface of the first dielectric annular member (3) is exposed, whereby a strip line (Za) is formed by the second conductor film (8), the electric conductor lines (5 and 6), and a first covered portion of the first conductor film (4), and a microstrip line (Zb) is formed by the electric conductor lines (5 and 6), and a second exposed portion of the first conductor film (4). A third conductor film (9a and 9b) to be grounded is provided in the first dielectric annular member (3) in correspondence with second exposed portion of the first dielectric annular member ( 3), which is closer to the conductor lines (5 and 6) than the first conductor film (4) and constituting, with the conductor lines, a further microstrip line (Zb).