The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 1993

Filed:

Oct. 07, 1991
Applicant:
Inventors:

Detlef Arnoldi, Hanau, DE;

Edwin Nun, Brachttal, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L / ; C08K / ; C08K / ;
U.S. Cl.
CPC ...
524593 ; 524291 ; 524424 ; 525155 ; 525400 ;
Abstract

Polyoxymethylene molding materials having improved thermal stability and reduced formaldehyde emission consisting essentially of a polyoxymethylene as the main component and containing in addition, relative in each instance to the weight of the polyoxymethylene, 0.1 to 10% by weight of an endocopolymerizate, 0.05 to 3% by weight of a phenolic antioxidant, 0 to 5% by weight carbon black and 0 to 3% by weight of further additives customary in polyoxymethylene molding materials.


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Arnoldi, Detlef. (1993). Polyoxymethylene molding materials having improved thermal stability and (U.S. Patent No. 5218041). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5218041

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