The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 08, 1993

Filed:

Jul. 25, 1991
Applicant:
Inventors:

Yuichi Orikasa, Yokohama, JP;

Suehiro Sakazume, Fujisawa, JP;

Sadahiro Nishimura, Kawasaki, JP;

Yoshinori Maki, Chigasaki, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08L / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
524504 ; 524404 ; 524423 ; 524451 ; 524495 ; 524508 ; 524513 ; 525 64 ; 525 67 ; 525 68 ; 525263 ; 525277 ; 525286 ; 525905 ;
Abstract

There is here provided a thermoplastic resin composition which comprises (I) 99 to 1% by weight of an aromatic polyester resin, (II) 1 to 99% by weight of at least one kind of resin selected from the group consisting of a polyphenylene ether resin, a mixture of the polyphenylene ether resin and a styrene polymer, a polycarbonate resin, and a polyarylene sulfide resin, (III) 0.1 to 100 parts by weight, based on 100 parts by weight of the aforesaid resins (I)+(II), of a multi-phase structure thermoplastic resin which is composed of 5 to 95% by weight of an epoxy group-containing olefin copolymer and 95 to 5% by weight of a vinyl polymer or copolymer obtained from at least one kind of vinyl monomer, either of both the components being formed with a dispersion phase having a particle diameter of 0.001 to 10 .mu.m. A method for preparing the above-mentioned thermoplastic resin composition is also provided here.


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