The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 1993
Filed:
Mar. 25, 1992
Hiroyuki Noguchi, Sayama, JP;
Yasuo Watanabe, Sayama, JP;
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
A method of and an apparatus for automatically removing deposits such as resin materials adhering to an injection head. According to the method, a liquid reactive resin is poured into a molding cavity internally defined in a mold assembly from an injection head through an injection hole. Then, an automatic cutting device is displaced toward the injection head separated from the injection hole after the reactive resin poured into the molding cavity has been hardened. Thereafter, the automatic cutting device is activated to cut unnecessary hardened resin materials adhering to the injection head. Thus, the hardened resin materials can reliably be removed without subjecting the injection head to damage. It is also possible to effectively prevent the reactive resin from adhering to the injection head when the next molding process is carried out. Further, since a resin material removing process is automatically performed, any burden imposed on an operator can be lightened and the entire molding process can efficiently be carried out.