The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 1993
Filed:
Jan. 21, 1992
Jung S Han, Suwon, KR;
EHWA Diamond Ind. Co., Ltd., Kyongki, KR;
Abstract
A wire saw comprising a wire rope 120, a plurality of abrasive sleeves 110 each including a cylindrical mount 112 and an abrasive metal layer 114, an elastic material layer 130 of resin surrounding the wire rope 120 between the abrasive sleeves 110 and between each of the abrasive sleeves 110 and the wire rope 120, and a clamping pipe 140 for making the wire saw be endless to form a loop. The abrasive sleeves 110 surround the wire rope and are spaced at predetermined intervals longitudinally of the wire rope. The cylindrical mount 112 includes a pair of annular grooves formed on outer opposite ends thereof and a pair of through-holes diagonally formed thereon. The elastic material layer 130 includes a plurality of annular grooves 132 spaced at predetermined intervals and formed by means of a shape of a mold 200, thereby providing a straightness for the wire rope regardless of an injection pressure of resin injected into the mold 200. The clamping pipe 140 comprises a center protrusion 142, end compressed depressions 144 and a cutting layer 146 covering the whole outer surface thereof in order to have a similar outer shape to that of the wire saw. The cutting layer 146 has diamond or carborundum particles which are dispersed thereon by means of electro deposition or hard facing.