The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1993
Filed:
Jul. 26, 1991
Junichi Nakao, Hyogo, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
The feature of the construction of this invention lies in a direct bond copper (DBC) pate. That is, a first Cu plate on which a semiconductor pellet is formed is fixed on the ceramic plate to continuously extend from the front surface of the ceramic plate to the rear surface thereof via one side surface thereof. Second Cu plates serving as electrodes of the semiconductor pellet are fixed on both sides of the Cu plate on the surface of the ceramic plate on which the semiconductor pellet is disposed. Electrode pads formed on the semiconductor pellet fixed on the first Cu plate are electrically connected to the second Cu plates by means of bonding wires. Since the the first Cu plate is continuously formed on the rear surface of the ceramic plate which is opposite to the surface on which the semiconductor pellet is mounted, the fixation surface of the semiconductor pellet is electrically connected to a heat sink plate.