The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1993
Filed:
Apr. 27, 1992
Akira Yoshizumi, Yokohama, JP;
Shinetsu Fujieda, Kawasaki, JP;
Ken Uchida, Tokyo, JP;
Naoko Kihara, Matsudo, JP;
Kazuhiro Sawai, Kawaguchi, JP;
Tsutomu Nagata, Iwatsuki, JP;
Shinji Murakami, Kawaguchi, JP;
Shigeyuki Kouchiyama, Kawaguchi, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Toshiba Chemical Corporation, Tokyo, JP;
Abstract
A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.