The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1993
Filed:
Feb. 24, 1992
Applicant:
Inventors:
Assignee:
Robert Bosch GmbH, Stuttgart, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228122 ; 228124 ; 228175 ; 228189 ;
Abstract
A method of mounting a semiconductor wafer (10) on a metallic mounting surface, particularly during manufacture of valves with macromechanical valve bodies (20), features the steps of applying a metallization (11) to at least one major surface of the semiconductor wafer, and thereafter soldering the thus-metallized major surface, either wholly or in localized surface areas, to the metallic mounting surface.
Buchholz, Juergen. (1993). Method of mounting silicon wafers on metallic mounting surfaces (U.S. Patent No. 5215244). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5215244
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile